| Formulation Name (Grade: HOPELEX AG-3030) total : 0 |
|---|
| Formulaton Name (Material: Polycarbonate > PC Compound Styrenics Polymers > ABS Compound) total : 8 More |
|---|
| PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-1(2.0mm) |
| PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 Fail(2.0mm) |
| PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 Fail(2.0mm) |
| PC/ABS ; Graphite, BN ; 열전도도 측정불가 |
| PC/ABS ; 난연성 Fail(1.6mm) |
| () | HOPELEX AG-3030 (HOPELEX) |  |
롯데케미칼 | |
|---|---|---|---|---|
| PC/ABS compound | ||||
| Application | 전자제품 | |||
| Feature | 내가수분해성 내충격성 | |||
| Process |
(Technical)042-879-1916 |
|||
| Mechanical | ||||
|---|---|---|---|---|
| Izod impact strength(ASTM), Notched | 588.4 | J/m | ASTM D256 | 23°C, 1/8inch |
| Izod impact strength(ASTM), Notched | 392.3 | J/m | ASTM D256 | -30℃, 1/8inch |
| Flexural modulus | 2353.6 | MPa | ASTM D790 | 10mmmin |
| Flexural strength | 86.3 | MPa | ASTM D790 | 10mmmin |
| Tensile strength at yield | 56.9 | MPa | ASTM D638 | 50mmmin |
| Elongation at break | Min. 50.0 | % | ASTM D638 | 50mmmin |
| Physical | ||||
| Specific gravity | 1.1 | ASTM D792 | ||
| Thermal | ||||
| Heat Deflection Temperature @1.82MPa | 105.0 | ˚C | ASTM D648 | |
| Flammability | ||||
| Flammability | HB | class | UL94 | 3.0mm |
| Flammability | HB | class | UL94 | 1.2mm |
| Other | ||||
| Mold shrinkage | 0.5 ~ 0.7 | % | ASTM D955 |
| 전자 하우징을 포함하여 다양한 분야에 적용 | |||
| 양유동, 고충격, 내가수분해성 | |||
| Region | Update | 2022.10.14 | |
