Formulation Name (Grade: HOPELEX AN-3700) total : 0
Formulaton Name (Material: Polycarbonate > PC Compound
Styrenics Polymers > ABS Compound) total : 8 More
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-1(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 Fail(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 Fail(2.0mm)
PC/ABS ; Graphite, BN ; 열전도도 측정불가
PC/ABS ; 난연성 Fail(1.6mm)
() HOPELEX AN-3700 (HOPELEX) home 롯데케미칼
PC/ABS compound
  • Polycarbonate > PC Compound
  • Styrenics Polymers > ABS Compound
  • Application전자제품, 전자제품 > 사무기기 > 팩스, 프린터 하우징
    Feature내가수분해성 할로겐 난연성 내충격성
    Process (Technical)042-879-1916
    Mechanical
    Flexural strength 86.3 MPa ASTM D790 10mmmin
    Elongation at break Min. 100.0 % ASTM D638 50mmmin
    Flexural modulus 2451.7 MPa ASTM D790 10mmmin
    Tensile strength at yield 57.9 MPa ASTM D638 50mmmin
    Izod impact strength(ASTM), Notched 490.3 J/m ASTM D256 23°C, 1/8inch
    Physical
    Specific gravity 1.2 ASTM D792
    Thermal
    Heat Deflection Temperature @1.82MPa 80.0 ˚C ASTM D648
    Flammability
    Flammability V-0 class Lotte Chemical method 1.5mm
    Other
    Mold shrinkage 0.4 ~ 0.6 % ASTM D955
    사무기기 및 전자 하우징을 포함하여 다양한 분야에 적용
    양유동, 고충격, 내가수분해성, 비할로겐 난연
    RegionUpdate2022.10.14