Formulation Name (Grade: HOPELEX LX-7603) total : 0
Formulaton Name (Material: Polycarbonate > PC Compound) total : 75 More
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-1(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-2(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
() HOPELEX LX-7603 (HOPELEX) home 롯데케미칼
PC compound
  • Polycarbonate > PC Compound
  • Application
    Feature이형성 내충격성
    Process (Technical)042-879-1916
    Mechanical
    Elongation at break Min. 100.0 % ASTM D638 50mmmin
    Tensile strength at yield 59.8 MPa ASTM D638 50mmmin
    Flexural strength 87.3 MPa ASTM D790 10mmmin
    Izod impact strength(ASTM), Notched 735.5 J/m ASTM D256 23°C, 1/8inch
    Flexural modulus 2255.6 MPa ASTM D790 10mmmin
    Physical
    Specific gravity 1.2 ASTM D792
    Thermal
    Heat Deflection Temperature @1.82MPa 129.0 ˚C ASTM D648
    Optical
    Transmittance 70.0 % ASTM D1003
    Flammability
    Flammability V-0 class UL94 1.5mm
    Other
    Mold shrinkage 0.5 ~ 0.7 % ASTM D955
    확산판, 확산 프로파일 및 마감재
    고충격, 비할로겐 난연
    RegionUpdate2022.10.14