Formulation Name (Grade: HOPELEX LX-7000) total : 0
Formulaton Name (Material: Polycarbonate > PC Compound) total : 75 More
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-1(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-2(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
() HOPELEX LX-7000 (HOPELEX) home 롯데케미칼
PC compound
  • Polycarbonate > PC Compound
  • Application
    Feature이형성 내충격성
    Process (Technical)042-879-1916
    Mechanical
    Flexural strength 88.3 MPa ASTM D790 10mmmin
    Elongation at break Min. 100.0 % ASTM D638 50mmmin
    Izod impact strength(ASTM), Notched 735.5 J/m ASTM D256 23°C, 1/8inch
    Tensile strength at yield 60.8 MPa ASTM D638 50mmmin
    Flexural modulus 2353.6 MPa ASTM D790 10mmmin
    Physical
    Specific gravity 1.2 ASTM D792
    Melt index 8.5 g/10min ASTM D1238 300℃, 1.2kg
    Thermal
    Heat Deflection Temperature @1.82MPa 130.0 ˚C ASTM D648
    Heat Deflection Temperature @0.46MPa 140.0 ˚C ASTM D648
    Softening temperature 150.0 ˚C ASTM D1525 Rate B/50
    Other
    Mold shrinkage 0.5 ~ 0.7 % ASTM D955
    광확산 grade
    고점도, 고충격, 이형성
    RegionUpdate2022.10.14