| Formulation Name (Grade: HOPELEX PCG-2305) total : 0 |
|---|
| Formulaton Name (Material: Polycarbonate > PC Compound: GF 30%) total : 0 |
|---|
| () | HOPELEX PCG-2305 (HOPELEX) |  |
롯데케미칼 | |
|---|---|---|---|---|
| PC compound, GF 30% | ||||
| Application | 전자제품 | |||
| Feature | 할로겐 난연성 이형성 내충격성 | |||
| Process |
(Technical)042-879-1916 |
|||
| Mechanical | ||||
|---|---|---|---|---|
| Flexural strength | 196.1 | MPa | ASTM D790 | 10mmmin |
| Tensile strength at yield | 137.3 | MPa | ASTM D638 | 50mmmin |
| Flexural modulus | 7257.0 | MPa | ASTM D790 | 10mmmin |
| Izod impact strength(ASTM), Notched | 156.9 | J/m | ASTM D256 | 23°C, 1/8inch |
| Physical | ||||
| Specific gravity | 1.4 | ASTM D792 | ||
| Thermal | ||||
| Heat Deflection Temperature @1.82MPa | 141.0 | ˚C | ASTM D648 | |
| Flammability | ||||
| Flammability | V-0 | class | UL94 | 3.0mm |
| Flammability | 5VA | class | UL94 | 3.0mm |
| Flammability | V-0 | class | UL94 | 1.5mm |
| Other | ||||
| Mold shrinkage | 0.15 ~ 0.25 | % | ASTM D955 |
| 전기전자 하우징 등 | |||
| 이형성, 비할로겐 난연, 고탄성률, 고충격 | |||
| Region | Update | 2022.10.14 | |
