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Formulation Name (Grade: HOPELEX PCM-2303) total : 0
Formulaton Name (Material: PC Compound) total : 75 More
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-1(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-2(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
() HOPELEX PCM-2303 (HOPELEX) home 롯데케미칼
PC compound, Milled GF 30%
  • Application
    Feature이형성
    Process (Technical)042-879-1916
    전기전자 하우징 등
    좋은 표면, 이형성
    RegionUpdate2022.10.14