Formulation Name (Grade: HOPELEX PCN-2001W) total : 0
Formulaton Name (Material: Polycarbonate > PC Compound) total : 75 More
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-1(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-2(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm)
() HOPELEX PCN-2001W (HOPELEX) home 롯데케미칼
PC compound
  • Polycarbonate > PC Compound
  • Application전자제품
    Feature이형성
    Process (Technical)042-879-1916
    Mechanical
    Tensile strength at yield 63.7 MPa ASTM D638 50mmmin
    Izod impact strength(ASTM), Notched 735.5 J/m ASTM D256 23°C, 1/8inch
    Elongation at break Min. 100.0 % ASTM D638 50mmmin
    Flexural strength 88.3 MPa ASTM D790 10mmmin
    Flexural modulus 2353.6 MPa ASTM D790 10mmmin
    Physical
    Specific gravity 1.2 ASTM D792
    Thermal
    Heat Deflection Temperature @1.82MPa 130.0 ˚C ASTM D648
    Flammability
    Flammability V-2 class UL94 1.5mm
    Flammability V-2 class UL94 3.0mm
    Other
    Mold shrinkage 0.5 ~ 0.7 % ASTM D955
    전기전자 하우징 등
    중점도, 이형성, 화이트컬러에 이용가능
    RegionUpdate2022.10.14