| Formulation Name (Grade: HOPELEX PCP-2704) total : 0 |
|---|
| Formulaton Name (Material: Polycarbonate > PC Compound) total : 75 More |
|---|
| PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-1(2.0mm) |
| PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm) |
| PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-2(2.0mm) |
| PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm) |
| PC/ABS, PLA ; Phosphorus FR, Talc ; 난연성 V-0(2.0mm) |
| () | HOPELEX PCP-2704 (HOPELEX) |  |
롯데케미칼 | |
|---|---|---|---|---|
| PC compound | ||||
| Application | 전자제품 | |||
| Feature | 고유동성 할로겐 난연성 이형성 | |||
| Process |
(Technical)042-879-1916 |
|||
| Mechanical | ||||
|---|---|---|---|---|
| Flexural modulus | 2549.8 | MPa | ASTM D790 | 10mmmin |
| Tensile strength at yield | 58.8 | MPa | ASTM D638 | 50mmmin |
| Elongation at break | Min. 100.0 | % | ASTM D638 | 50mmmin |
| Flexural strength | 96.1 | MPa | ASTM D790 | 10mmmin |
| Izod impact strength(ASTM), Notched | 588.4 | J/m | ASTM D256 | 23°C, 1/8inch |
| Physical | ||||
| Specific gravity | 1.2 | ASTM D792 | ||
| Thermal | ||||
| Heat Deflection Temperature @1.82MPa | 100.0 | ˚C | ASTM D648 | |
| Flammability | ||||
| Flammability | V-0 | class | UL94 | 0.8mm |
| Flammability | V-0 | class | UL94 | 3.0mm |
| Other | ||||
| Mold shrinkage | 0.5 ~ 0.7 | % | ASTM D955 |
| 전기전자 하우징 등 | |||
| 고유동, 고충격, 이형성, 비할로겐 난연, 불투명 컬러에 이용가능 | |||
| Region | Update | 2022.10.14 | |
